To meet or exceed our customer’s requirements by producing, PSI delivers and supports all products and services on a timely and consistent basis. We devote ourselves into this professional category, and provide timely service for customers.
Our goal is to become a high mix/low volume manufacturer, and to provide a variety of products with mid-small quantity. To satisfying customer's unique demand, we remind ourselves of facing everything with care, with positive attitude and with great responsibility, by which will provide the best service for customers. To meet more customer's demands for mid-small volume products, we have built the 5th SMT line, which has greatly improved our competitiveness and will satisfy more customers.
By building the 5th SMT line, we are hoping to achieve the goal of meeting our customer's expectation better and of making greater profit for the company.
The entire new SMT line consists of EKRA E5 Soldering Paste Applying Machine, Panasonic CM-402L High Speed Machine, Panasonic BM231 High Speed XPM2 N2Machine and Vitronics XPM2 N2 Reflow Oven.
Description in detail:
1. EKRA E5 Soldering Paste Applying Machine
(a) Designed for high yield rate, serial soldering paste applying
(b) Advanced EVA dual-cam visual inspection system
(c) Quick line switching and programming
(d) Easy operation, low defective rate
(e) High yield rate
(f) Spec.:
(b) Advanced EVA dual-cam visual inspection system
(c) Quick line switching and programming
(d) Easy operation, low defective rate
(e) High yield rate
(f) Spec.:
- Board Size: 50*80 ~ 550*550mm
- Board Size: 50*80 ~ 550*550mm
- Sliding rail adjustment: Auto
- Frame size: 300x300mm ~ 850x1000mm(no coupler required on adjustment)
- Board thickness: 0.4~6mm
- Board Size: 50*80 ~ 550*550mm
- Sliding rail adjustment: Auto
- Frame size: 300x300mm ~ 850x1000mm(no coupler required on adjustment)
- Board thickness: 0.4~6mm
(a) High yield rate
- Max. CPH: 100,000 (0.035 sec/chip)
- Max. Tool compatibility: 216 types (excellent tooling compatibility)
- Changeable Head
- Max. Tool compatibility: 216 types (excellent tooling compatibility)
- Changeable Head
Super High Speed Head: 0402~5 mm
High Speed Head: 0603～24 mm , thickness : 6.5 mm
Multi-Function Head: 0603～100ｘ90 mm, thickness : 21 mm
High Speed Head: 0603～24 mm , thickness : 6.5 mm
Multi-Function Head: 0603～100ｘ90 mm, thickness : 21 mm
(b) Great Movability / Highly Exchangeable
(c) High Quality Assembly
(c) High Quality Assembly
- High Speed Head: ±50μm, Cpk1.0 or above
- Multi-Function Head: ±35μm, Cpk1.0 or above
- Multi-Function Head: ±35μm, Cpk1.0 or above
(d) High Speed Assembly Head
(e) 5 types of FEEDER only (regular)
(f) Spec.:
(e) 5 types of FEEDER only (regular)
(f) Spec.:
- Board Size: 50*50 ~ 510*460mm
- Board thickness: 0.3~4mm
- Working Speed: 0.036sec/chip, 0.18sec/QFP (In optimum)
- Board Switching Time: 2.3 sec
- Min. working parts size: 0201 chip
- Board thickness: 0.3~4mm
- Working Speed: 0.036sec/chip, 0.18sec/QFP (In optimum)
- Board Switching Time: 2.3 sec
- Min. working parts size: 0201 chip
3. Panasonic BM231 High Speed Machine (for General Purpose)
(a) High Yield Rate
- 60 (Dual-Swivel Rack: 120), Tray: 80
(b) Great Movability / Highly Exchangeable
(c) High Quality Assembly
(c) High Quality Assembly
- Chip Parts: ±50μm, Cpk1.0 or above
- QFP Parts: ±30μm, Cpk1.0 or above
- QFP Parts: ±30μm, Cpk1.0 or above
(d) With Stand Type Dual-Tray Feeder
(e) Spec.:
(e) Spec.:
- Board Size: 50*50 ~ 510*460 mm
- Board Thickness: 0.3~4 mm
- Working Speed: 0.25 sec/chip
- Board Switching Time: 5 sec
- Working Parts Size : 0402 chip ～ L 150 × W 25 × T 25 mm or L 55 × W 55 × T 25 mm
- Board Thickness: 0.3~4 mm
- Working Speed: 0.25 sec/chip
- Board Switching Time: 5 sec
- Working Parts Size : 0402 chip ～ L 150 × W 25 × T 25 mm or L 55 × W 55 × T 25 mm
4. Vitronics XPM2 N2 Reflow
(a) With unique multi-air nozzle, keeping perfect temperature stability and heat feedback
(b) With protection of nitrogen to ensure better soldering
(c) With best cooling area to fit lead free process
(d) Detecting the temperature of components during board reflowing
(e) With rail type and crossing type of transport device
(f) Operated by computer programs under the Window system
(b) With protection of nitrogen to ensure better soldering
(c) With best cooling area to fit lead free process
(d) Detecting the temperature of components during board reflowing
(e) With rail type and crossing type of transport device
(f) Operated by computer programs under the Window system
