PSI imported VECTECH 3500D repair platform in October 2021. Its functions are described below:

The VECTECH 3500D system uses microprocessor control and infrared sensor temperature monitoring technology to disassemble and weld surface mount components safely and accurately. The entire process can be controlled and recorded by welding software (BGA SOFT) to meet the higher process requirements of modern electronics industry. It is the most valuable electronic equipment in the field of electronic industry. VECTEC 3500 repair workstation is divided into two parts: IR infrared repair system and PL precision optical placement system.

In order to obtain optimal control of welding process and non destructive repeatable production of PCB temperature, IR section provides the heating power of 4500 w, meet all kinds of patch of lead-free welding chip repair process: in order to achieve the required more rigorous lead-free soldering process window, leads to the whole of the PCB and SMT chip temperature get effective control, IR3500D adopts the temperature real dead-cycle control reflow welding technology to ensure its accurate temperature control ability and meet the small process window requirements of lead-free welding uniform heat distribution and appropriate controllable peak temperature, so as to ensure high reliable lead-free welding.

The VECTECH 3500D uses infrared sensing technology and death-cycle control principle, with the ability to accurately unsolder components. Thanks to the non-contact infrared temperature sensor; At any time, the welding process is monitored by a non-contact infrared sensor in real time to be repaired chip temperature, and give the best temperature control: medium wavelength infrared heater, with the power and flexibility necessary for uniform heating and safe heating, for high thermal capacity PCB chip repair can be easily handled. The adjustable window below the infrared heater can lower the heating temperature of the intolerant components near the chip, thus protecting the safety of the components.

The VECTECH 3500D uses an "open" heating environment. The device itself has 10 built-in process storage channels, and process parameters in each storage channel can be set and modified through the Control box, of course, also can be set and modified by external computer through BGASOFT software.

The use of Reflow Process Camera (RPC) provides key visual information for the accurate judgment of solder melting in the whole welding and desoldering Process.

VECTECH3500DPL precision optical alignment system provides accurate alignment control for the welding process of VECTECH3500D repair system. Its precise fine-tuning and accurate alignment information provided by the camera are important guarantees for chip repair. PL adopts external control box for operation control, which, together with IR heating system and RPC monitoring system, forms a complete SET of BGA repair system, creating a high-end work place for the repair of modern electronic products.