Add the fourth SMT Line in PSI-TWN
Author：Alex Chen
To meet or exceed our customer’s requirements by producing, delivering and supporting all products and services on a timely and consistent basis” is our quality policy. We are aalways following this principle to make more effort in the fields and expect that we can know more about their business than customer to offer more product services by customer’s need.
Our vision is to be a guardian of low to middle volume and high mix production. So our sales order type is most of low to middle volume and high mix products. In response of customer demand ,we always remind ourselves to face everything cautiously and have an attitude of active、flexible and responsible to supply the best services for every customer. Currently response to add more new customer and low volume/high mix orders, we set the fourth SMT line to let our services quality can meet customer’s requirements and reach our target by yearly. By the SMT capacity increasing, on the one hand can meet the customer delivery requirements, and on the other hand will help the company create more profit and achieve the sustainable development goal.
The new SMT line consists of EKRA E5 solder paste printer、Panasonic CM-602L high speed mounter、Panasonic BM231 multi function high speed mounter and Vitronics XPM2 N2 Reflow.
The details as following：
1. EKRA E5 solder paste printer
a) The major developed in high volume and connection on line printer by production.
b) EVA ultra-advanced dual camera visual inspection system
c) Quick change product and program for production
d) Easy to operation and low defect rate produced
e) High utility rate capacity machine
f) Specification :
b) EVA ultra-advanced dual camera visual inspection system
c) Quick change product and program for production
d) Easy to operation and low defect rate produced
e) High utility rate capacity machine
f) Specification :
- Board Size : 50*80 ~ 550*550mm
- Automatic track width adjustment
- Frame Size : 300*300 ~ 850*1000mm
- Board thickness : 0.4 ~ 6mm
- Automatic track width adjustment
- Frame Size : 300*300 ~ 850*1000mm
- Board thickness : 0.4 ~ 6mm
2. Panasonic CM-602L High Speed Mounter
a) High productivity
c) High-quality mounting
e) Feeder only 5 types (standard)
f) Specification :
- The maximum CPH value is 100,000 CPH (0.035sec / Chip).
- It can carry up to 216 type of parts : There are well at the parts corresponding ability.
- Mounting head can be replaced:
Super High-speed Head: 0402 ~ 5 mm
High-Speed Head: 0603 ~ 24 mm, thickness T: 6.5mm
Multi Function Head: 0603 ~ 100x90 mm, thickness T: 21mm
b) High utilization rate and high switch resistance- It can carry up to 216 type of parts : There are well at the parts corresponding ability.
- Mounting head can be replaced:
Super High-speed Head: 0402 ~ 5 mm
High-Speed Head: 0603 ~ 24 mm, thickness T: 6.5mm
Multi Function Head: 0603 ~ 100x90 mm, thickness T: 21mm
c) High-quality mounting
- High Speed Head: ± 50μm, Cpk1.0 more"
- Multi Function Head: ± 35μm, Cpk1.0 more"
d) High-speed mounting HEAD- Multi Function Head: ± 35μm, Cpk1.0 more"
e) Feeder only 5 types (standard)
f) Specification :
- Board Size : 50*50 ~ 510*460mm
- Board thickness : 0.3 ~ 4mm
- Placement Speed : 0.036sec/chip ,0.18sec/QFP(In optimum)
- Board Replacement Time : 2.3sec
- Placement minimum component : 0201 chip
- Board thickness : 0.3 ~ 4mm
- Placement Speed : 0.036sec/chip ,0.18sec/QFP(In optimum)
- Board Replacement Time : 2.3sec
- Placement minimum component : 0201 chip
3. Panasonic BM231 multi function high speed mounter
a) High productivity
c) High-quality mounting
e) Specification :
- Single Feeder : 60 (Double Feeder：120)、Tray：80
b) High utilization rate and high switch resistance c) High-quality mounting
- Chip：±50μm,Cpk1.0 more
- QFP : ±30μm,Cpk1.0 more
d) Equipped with a vertical double-type feeder tray- QFP : ±30μm,Cpk1.0 more
e) Specification :
- Board Size : 50*50 ~ 510 x 460mm
- Board thickness : 0.3 ~ 4mm
- Placement Speed : 0.25sec/chip
- Board Replacement Time : 5sec
- Placement component : 0402chip ～ L 150 × W 25 × T 25 mm or L 55 × W 55 × T 25 mm.
- Board thickness : 0.3 ~ 4mm
- Placement Speed : 0.25sec/chip
- Board Replacement Time : 5sec
- Placement component : 0402chip ～ L 150 × W 25 × T 25 mm or L 55 × W 55 × T 25 mm.
4. Vitronics XPM2 N2 Reflow
a) To keep the best average temperature and thermal compensation capacity by a unique multi-
nozzle air flow control design.
b) To have a Nitrogen protection for increasing solderability.
c) To have a good cooling area design for lead free process requirement.
d) It can monitor the component temperature during board reflowed.
e) There are dual conveyor device of rail mounted and meshed belt.
f) All of programmer control by computer in Window OS operation.
nozzle air flow control design.
b) To have a Nitrogen protection for increasing solderability.
c) To have a good cooling area design for lead free process requirement.
d) It can monitor the component temperature during board reflowed.
e) There are dual conveyor device of rail mounted and meshed belt.
f) All of programmer control by computer in Window OS operation.
